Multi-story substrate treating apparatus with flexible transport mechanisms and vertically divided treating units

ABSTRACT

A substrate treating apparatus includes a first treating block and a second treating block disposed adjacent to the first treating block. Each of the first treating block and the second treating block include a plurality of stories arranged vertically. Each of the plurality of stories includes treating units for treating substrates and a main transport mechanism for transporting the substrates to and from the treating units. The substrates are transportable between the stories of the first treating block and the stories of the second treating block at same heights as corresponding stories of the first treating block. The substrates are transportable between the stories of the first treating block and the stories of the second treating block at different heights from corresponding stories of the first treating block.

CROSS-REFERENCES TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.12/324,802, filed on Nov. 26, 2008 which claims priority to JapanesePatent Application No. JP2007-310677, filed on Nov. 30, 2007, the entiredisclosures of which are hereby incorporated by reference in theirentirety for all purposes.

BACKGROUND OF THE INVENTION

This invention relates to a substrate treating apparatus for performinga series of treatments of substrates such as semiconductor wafers, glasssubstrates for liquid crystal displays, glass substrates for photomasks,and substrates for optical disks (hereinafter called simply“substrates”).

Conventionally, this type of substrate treating apparatus is used toform a resist film on substrates and develop the substrates exposed in aseparate exposing machine. The apparatus includes a treating sectionhaving, arranged therein, a coating block for forming film such asresist film, a developing block for developing the substrates, and soon. Each treating block includes a single main transport mechanism andvarious treating units. The main transport mechanism of each treatingblock, while transporting substrates to the treating units in thattreating block, transfers the substrates through receivers to and fromthe main transport mechanism of another, adjacent, treating block tocarry out a series of treatments of the substrates (as disclosed inJapanese Unexamined Patent Publication No. 2003-324139, for example).

The conventional apparatus with such a construction has the followingdrawbacks.

In the conventional apparatus, when the main transport mechanism of oneof the treating blocks breaks down or otherwise becomes unable totransport substrates (abnormal state), it becomes altogether impossibleto transport the substrates to and from other, adjoining, treatingblocks. Only a single route (transport path) is available fortransporting the substrates between the treating blocks, and thustransporting is lacking in flexibility. Consequently, there occurs aninconvenience that the substrates cannot be treated at all even thoughthe main transport mechanisms of the other treating blocks are in anormal condition.

SUMMARY OF THE INVENTION

This invention has been made having regard to the state of the art notedabove, and its object is to provide a substrate treating apparatus thatcan transport substrates flexibly between adjoining treating blocks.

The above object is fulfilled, according to an embodiment of theinvention, by a substrate treating apparatus comprising a plurality oftreating blocks juxtaposed horizontally, each including stories ofvertically divided treating units arranged for treating substrates, anda main transport mechanism provided on each of the stories fortransporting the substrates to and from the treating units arrangedthereon; wherein the substrates are transportable between the samestories of adjoining ones of the treating blocks, and transportablebetween different stories of at least a pair of adjoining ones of thetreating blocks.

According to this embodiment, the substrates are transported betweenadjoining treating blocks, thereby allowing a series of treatments to becarried out for the substrates in parallel. A series of treatments canbe carried out for the substrates also by transporting the substrates toand from a different story of at least one of the adjoining treatingblocks. Thus, since this apparatus provides transport paths greater innumber than the stories, the substrates can be transported flexibly. Asa result, even when one of the main transport mechanisms falls into anabnormal state unable to transport the substrates, the series oftreatments can be carried out for the substrates by transporting thesubstrates through transport paths not including this main transportmechanism.

In the embodiment noted above, the apparatus may further comprise amovable receiver for receiving the substrates, disposed between thetreating blocks where the substrates are transportable between differentstories, to be vertically movable to a plurality of stories. With themovable receiver vertically movable to a plurality of stories, thesubstrates can be transported to and from different stories between thetreating blocks juxtaopposed to each other with the movable receiver inbetween.

In the embodiment noted above, the main transport mechanisms of thetreating blocks juxtaopposed to each other with the movable receiver inbetween may be capable of transporting the substrates to and from themovable receiver. With the main transport mechanisms capable oftransporting the substrates to and from the movable receiver, the maintransport mechanisms of the treating blocks juxtaopposed to each otherwith the movable receiver in between can conveniently transfer thesubstrates to and from each other through the movable receiver.

In the embodiment noted above, the movable receiver, upon receipt of asubstrate, may be movable to a story different from a story where themovable receiver has received the substrate. With the movable receiverholding a substrate and moving to a story different from a story wherethe movable receiver has received the substrate, the substrates can betransported between different stories of the treating blocks having themovable receiver in between.

In the embodiment noted above, the movable receiver may be movable toall the stories. In the treating blocks having the movable receiver inbetween, the substrates can be transported from each story of onetreating block to all the stories of the other treating block. Thesubstrates can also be transported from each story of the other treatingblock to all the stories of one treating block.

In the embodiment noted above, the apparatus may further comprise,arranged between the treating blocks where the substrates aretransportable between different stories, a plurality of fixed receiversprovided for the respective stories; and a receiver transport mechanismfor transporting the substrates between the fixed receivers. With thereceiver transport mechanism transporting the substrates from the fixedreceiver of one story to the fixed receiver of another story, thesubstrates can be transported between different stories of the treatingblocks having the fixed receivers and receiver transport mechanism inbetween.

In the embodiment noted above, the main transport mechanisms of thetreating blocks juxtaopposed to each other with the fixed receivers inbetween may be capable of transporting the substrates to and from thefixed receivers. With the main transport mechanisms on each story beingcapable of transporting the substrates to and from the fixed receiver ofthat story, the main transport mechanisms of the treating blocksjuxtaopposed to each other with the fixed receivers in between canconveniently transfer the substrates through the fixed receivers.

In the embodiment noted above, when one of the main transport mechanismsof one of the treating blocks where the substrates are transportablebetween different stories is in an abnormal state, each of the maintransport mechanisms of the other treating block may be arranged totransfer the substrates to and from the other main transport mechanismof the one of the treating blocks. Even when the main transportmechanism on any one story is in an abnormal state, another story on thesame level with this story can transport the substrates to and fromdifferent stories, and can treat the substrates. Thus, even when a maintransport mechanism is in an abnormal state, it is possible to prevent asubstantial reduction in the operating ratio of the entire apparatus.

In the embodiment noted above, the treating blocks where the substratesare transportable between different stories may be a coating block, anda developing block disposed adjacent the coating block. The coatingblock has coating units and heat-treating units as the treating unitsfor forming resist film on the substrates, and first main transportmechanisms as the main transport mechanisms for transporting thesubstrates to and from the coating units and the heat-treating units.The developing block has developing units and heat-treating units as thetreating units for developing the substrates, and second main transportmechanisms as the main transport mechanisms for transporting thesubstrates to and from the developing units and the heat-treating units.The substrates can be transported between the same stories and betweendifferent stories of the coating block and developing block. Since thesubstrates can be transported flexibly in this way, the substrates canconveniently receive both the treatment to form resist film thereon andthe treatment to develop the substrates.

In the embodiment noted above, each story of the coating block may becapable of transporting the substrates to and from all the stories ofthe developing block. Then, the substrates can be transported withincreased flexibility between the coating block and developing block.

In the embodiment noted above, one part of the stories of the coatingblock may be arranged exclusively to form resist film on the substratesand feed the substrates with resist film formed thereon toward thedeveloping block; and another part of the stories of the coating blockmay be arranged exclusively to receive the substrates fed from thedeveloping block. The substrates need not receive treatment on the storyof the coating block dedicated to receiving the substrates fed from thedeveloping block. When, for example, a treating unit of the coatingblock is in an abnormal state, the story having this treating unit isgiven a task of only receiving the substrates fed from the developingblock. The efficiency of treating the substrates can be improvedcompared with the case where this story does not engage in substratetransport at all.

In another aspect of the invention, a substrate treating apparatuscomprises a plurality of treating blocks juxtaposed horizontally, eachincluding treating units arranged on each of stories divided verticallyfor treating substrates, and a main transport mechanism provided on eachof the stories for transporting the substrates to and from the treatingunits arranged thereon; wherein the substrates are transportable betweenthe same stories of adjoining ones of the treating blocks, and in atleast a pair of adjoining ones of the treating blocks, transportablebetween at least one of the stories of one of the treating blocks and adifferent story of the other treating block.

According to an embodiment, the substrates are transported betweenadjoining treating blocks, thereby allowing a series of treatments to becarried out for the substrates. A series of treatments can be carriedout for the substrates also by transporting the substrates to and from adifferent story of at least one of the adjoining treating blocks. Thus,since this apparatus provides transport paths greater in number than thestories, the substrates can be transported flexibly. As a result, evenwhen one of the main transport mechanisms falls into an abnormal stateunable to transport the substrates, the series of treatments can becarried out for the substrates by transporting the substrates throughtransport paths not including this main transport mechanism.

In the embodiment noted above, the main transport mechanism of the oneof the stories may be constructed extendible and retractable orvertically movable to and from a plurality of stories, including the oneof the stories within the one of the treating blocks, to transfer thesubstrates to and from the main transport mechanisms on a plurality ofstories of the adjoining treating block. With the main transportmechanism extendible and retractable or vertically movable to and from aplurality of stories, this main transport mechanism can transport thesubstrates conveniently to and from the main transport mechanisms ondifferent stories of the adjoining treating block.

In the embodiment noted above, the one of the stories may be capable oftransporting the substrates to and from all the stories of the adjoiningtreating block. Then, the substrates can be transported with increasedflexibility between the treating blocks.

In the embodiment noted above, the main transport mechanism of the oneof the stories may be constructed extendible and retractable orvertically movable to and from all the stories within the one of thetreating blocks to transfer the substrates to and from the maintransport mechanisms on all the stories of the adjoining treating block.The substrates can be transported with increased flexibility between thetreating blocks.

In the embodiment noted above, the treating blocks where the substratesare transportable between different stories may be a coating block and adeveloping block. The coating block has coating units and heat-treatingunits as the treating units for forming resist film on the substratesand first main transport mechanisms as the main transport mechanisms fortransporting the substrates to and from the coating units and theheat-treating units. The developing block has developing units andheat-treating units as the treating units for developing the substratesand second main transport mechanisms as the main transport mechanismsfor transporting the substrates to and from the developing units and theheat-treating units. The first main transport mechanisms and the secondmain transport mechanisms on the same stories are arranged to transferthe substrates with each other. The first main transport mechanism on atleast one of the stories is constructed extendible and retractable orvertically movable to and from a plurality of stories, including the oneof the stories, within the coating block, to transfer the substrates toand from the second main transport mechanisms. The substrates can betransported between the same stories and between different stories ofthe coating block and developing block. Since the substrates can betransported flexibly in this way, the substrates can convenientlyreceive both the treatment to form resist film thereon and the treatmentto develop the substrates.

In the embodiment noted above, the second main transport mechanism on atleast one of the stories may be constructed extendible and retractableor vertically movable to and from a plurality of stories, including theone of the stories within the one of the treating blocks, to transferthe substrates to and from the first main transport mechanisms. Then,the substrates can be transported with increased flexibility between thecoating block and developing block.

In the embodiment noted above, the treating blocks where the substratesare transportable between different stories may be a coating block and adeveloping block. The coating block has coating units and heat-treatingunits as the treating units for forming resist film on the substratesand first main transport mechanisms as the main transport mechanisms fortransporting the substrates to and from the coating units and theheat-treating units. The developing block has developing units andheat-treating units as the treating units for developing the substratesand second main transport mechanisms as the main transport mechanismsfor transporting the substrates to and from the developing units and theheat-treating units. The first main transport mechanisms and the secondmain transport mechanisms on the same stories are arranged to transferthe substrates with each other; and the second main transport mechanismon at least one of the stories is constructed extendible and retractableor vertically movable to and from a plurality of stories, including theone of the stories within the developing block, to transfer thesubstrates to and from the first main transport mechanisms. Thesubstrates can be transported between the same stories and betweendifferent stories of the coating block and developing block. Since thesubstrates can be transported flexibly in this way, the substrates canconveniently receive both the treatment to form resist film thereon andthe treatment to develop the substrates.

This specification discloses embodiments of an invention directed to thefollowing substrate treating apparatus:

(1) A substrate treating apparatus comprising a plurality of treatingblocks juxtaposed horizontally, each including treating units arrangedon each of stories divided vertically for treating substrates, and amain transport mechanism provided on each of the stories fortransporting the substrates to and from the treating units arrangedthereon wherein the substrates are transportable between the samestories of adjoining ones of the treating blocks and, in at least a pairof adjoining ones of the treating blocks, transportable between at leastone of the stories of one of the treating blocks and a plurality ofstories of the other treating block.

According to the substrate treating apparatus defined in (1) above, thesubstrates are transported between adjoining treating blocks, therebyallowing a series of treatments to be carried out for the substrates. Inat least a pair of adjoining treating blocks, the substrates aretransported also between at least one of the stories of one of thetreating blocks and a plurality of stories of the other treating block,thereby carrying out a series of treatments for the substrates. Thus,since this apparatus provides transport paths greater in number than thestories, the substrates can be transported flexibly. As a result, evenwhen one of the main transport mechanisms becomes unable to transportthe substrates, the substrates can be transported through transportpaths including the other main transport mechanism capable oftransporting the substrates normally, thereby carrying out the series oftreatments for the substrates.

(2) In an embodiment of the substrate treating apparatus, one of thestories of the coating block is arranged to transport the substrates toa story of the developing block different from the one of the stories.

According to the substrate treating apparatus defined in (2) above, thesubstrates can be transported flexibly from the coating block to thedeveloping block.

(3) In an embodiment of the substrate treating apparatus, one of thestories of the coating block is capable of transporting the substratesto and from all the stories of the developing block.

According to the substrate treating apparatus defined in (3) above, thesubstrates can be transported flexibly between the coating block and thedeveloping block.

(4) In an embodiment of the substrate treating apparatus, one of thestories of the developing block is capable of transporting thesubstrates to a different story of the coating block.

According to the substrate treating apparatus defined in (4) above, thesubstrates can be transported flexibly from the developing block to thecoating block.

(5) In an embodiment of the substrate treating apparatus, one of thestories of the developing block is capable of transporting thesubstrates to and from all the stories of the coating block.

According to the substrate treating apparatus defined in (5) above, thesubstrates can be transported flexibly between the coating block and thedeveloping block.

BRIEF DESCRIPTION OF THE DRAWINGS

For the purpose of illustrating the invention, there are shown in thedrawings several forms, it being understood, however, that the inventionis not limited to the precise arrangement and instrumentalities shown.

FIG. 1 is a schematic view showing an outline of a substrate treatingapparatus according to an embodiment of the present invention;

FIG. 2 is a schematic view showing an example of substrate transportpaths through the substrate treating apparatus according to anembodiment of the present invention;

FIG. 3 is a schematic view showing an example of substrate transportpaths through the substrate treating apparatus according to anembodiment of the present invention;

FIG. 4 is a schematic view showing an example of substrate transportpaths through the substrate treating apparatus according to anembodiment of the present invention;

FIG. 5 is a plan view showing an outline of the substrate treatingapparatus according to an embodiment of the present invention;

FIG. 6 is a schematic side view showing an arrangement of treating unitsincluded in the substrate treating apparatus;

FIG. 7 is a schematic side view showing an arrangement of treating unitsincluded in the substrate treating apparatus;

FIG. 8 is a view in vertical section taken on line a-a of FIG. 5;

FIG. 9 is a view in vertical section taken on line b-b of FIG. 5;

FIG. 10 is a view in vertical section taken on line c-c of FIG. 5;

FIG. 11 is a view in vertical section taken on line d-d of FIG. 5;

FIG. 12A is a plan view of coating units;

FIG. 12B is a sectional view of a coating unit;

FIG. 13 is a perspective view of a main transport mechanism;

FIG. 14 is a control block diagram of the substrate treating apparatusaccording to an embodiment of the present invention;

FIG. 15 is a flow chart of a series of treatments of substrates;

FIG. 16 is a view schematically showing operations repeated by eachtransport mechanism;

FIG. 17 is a view in vertical section of transporting spaces in asubstrate treating apparatus in a second embodiment;

FIG. 18 is a plan view of a modified substrate treating apparatus; and

FIG. 19 is a view in vertical section taken on line e-e of FIG. 18.

DETAILED DESCRIPTION OF THE INVENTION

Embodiments of this invention will be described in detail hereinafterwith reference to the drawings.

First Embodiment

An outline of this embodiment will be described first. FIG. 1 is aschematic view showing an outline of a substrate treating apparatus inthis embodiment.

This embodiment provides a substrate treating apparatus for formingresist film on substrates (e.g. semiconductor wafers) W, and developingexposed wafers W. This apparatus includes an indexer section(hereinafter called “ID section”) 1, a treating section 3, and aninterface section (hereinafter called “IF section”) 5. The ID section 1,treating section 3 and IF section 5 are arranged adjacent one another inthe stated order. An exposing machine EXP, which is an externalapparatus separate from this apparatus, is disposed adjacent the IFsection 5.

The ID section 1 receives wafers W transported to the apparatus fromoutside, and transports the wafers W to the treating section 3. Thetreating section 3 carries out treatment for forming film on the wafersW transported from the ID section 1, and treatment for developing thewafers W. The IF section 5 transports the wafers W to and from theexposing machine EXP. The exposing machine EXP exposes the wafers W.

The treating section 3 includes a coating block Ba and a developingblock Bb. The coating block Ba and developing block Bb are arranged sideby side between the ID section 1 and IF section 5. The coating block Bais disposed adjacent the ID section 1, while the developing block Bb isdisposed adjacent the IF section 5. The coating block Ba forms resistfilm on the wafers W. The developing block Bb develops the wafers W.

Each of the treating blocks Ba and Bb is vertically divided into aplurality of stories K. In this embodiment, the coating block Ba has anupper story K1 and a lower story K3. Similarly, the developing block Bbhas an upper story K2 and a lower story K4. The story K1 and story K2are at the same level (height position), and the story K3 and story K4are also at the same level (height position). The story K1 (K2) andstory K3 (K4) are at different levels (height positions). In thisspecification, the stories in the same height position are referred toas the “same stories” or “between the same stories” where appropriate.The stories in the different height positions are referred to as“different stories.”

The treating section 3 as a whole has a layered structure with thestories K1 and K2 forming an upper story, and the stories K3 and K4forming a lower story.

Each story K of the treating blocks Ba and Bb includes treating unitsfor treating wafers W, and a main transport mechanism for transportingthe wafers W to and from the treating units on that story. The treatingunits on each story K1 or K3 of the coating block Ba include coatingunits for forming resist film on the wafers W. The coating units are,for example, resist film coating units RESIST for applying a resist filmmaterial to the wafers W. The treating units on each story K2 or K4 ofthe developing block Bb include, for example, developing units DEV fordeveloping the wafers W. FIG. 1 shows only the resist film coating unitsRESIST and developing units DEV. Each of the coating block Ba anddeveloping block Bb corresponds to the treating block in this invention.

The apparatus constructed in this way operates as follows. Wafers W aretransported from the ID section 1 to the stories K1 and K3 of thecoating block Ba, respectively. On the stories K1 and K3, treatment iscarried out to form resist film on the wafers W. Upon completion of thistreatment, the wafers W with resist film formed thereon are transportedfrom the story K1 to either the story K2 or story K4. Similarly, thewafers W with resist film formed thereon are transported from the storyK3 to either the story K2 or story K4.

Each of the stories K2 and K4 transports the wafers W to the IF section5. The IF section 5 transports the wafers W to the exposing machine EXP.The exposing machine EXP exposes the wafers W having resist film formedthereon. Upon completion of the exposure, the exposed wafers W aretransported from the exposing machine EXP to the IF section 5.

The wafers W are transported from the IF section 5 to the stories K2 andK4 of the developing block Bb. On the stories K2 and K4, treatment iscarried out to develop the exposed wafers W. Upon completion of thistreatment, the treated wafers W are transported from the story K2 toeither the story K1 or story K3. Similarly, the treated wafers W aretransported from the story K4 to either the story K1 or story K3. Eachof the stories K1 and K3 transports the wafers W to the ID section 1.

In this way, the wafers W can be transported between the same stories ofthe adjoining treating blocks Ba and Bb (between story K1 and story K2,and between story K3 and story K4). It is also possible to transport thewafers W between the different stories K of the adjoining treatingblocks Ba and Bb, such as between story K1 and story K4 or between storyK2 and story K3.

Thus, there are four paths for transporting wafers W between thetreating blocks Ba and Bb, which are story K1-story K2 (r1 in FIG. 1),story K3-story K4 (r2), story K1-story K4 (r3), and story K3-story K2(r4). When the transport directions are distinguished, the number ofpaths is doubled to become eight. Consequently, even when it becomesimpossible for a certain story K to treat or transport wafers W, thesituation can be dealt with flexibly such as by transporting the wafersW through transport paths not including that story K. In such event, itis possible to operate the story of the other treating block B in thesame height position as the abnormal story K, thereby inhibiting asignificant reduction in the throughput of the entire apparatus.

This apparatus can transport wafers W through two transport paths R1 andR2 as shown in FIG. 2, for example. The transport path R1 is fortransporting wafers W between the same (upper) stories K1 and K2 of thetreating blocks Ba and Bb. The transport path R2 is for transportingwafers W between the upper story K1 of the treating block Ba and thelower story K4 of the treating block Bb. The story K3 is included inneither of the transport paths R1 and R2. Transporting wafers W throughsuch transport paths R1 and R2 is effective when treating units (e.g.resist film coating units RESIST) on the story K3 cannot treat wafers W,or when the main transport mechanism on the story K3 cannot transportwafers W (i.e. in an abnormal state). All the wafers W developed in thedeveloping block Bb are transported to the story K1. This renders thequality of treatment among the wafers W more uniform than where thewafers W developed in the developing block Bb are transported to thedifferent story K1 and story K3. The transport paths R1 and R2 allow thewafers W to receive the treatment for forming resist film on the samestory K1, and receive the developing treatment on the different storiesK2 and K4. This is effective also in that, by carrying out a series oftreatments for the wafer W through such transport paths R1 and R2, thestories K2 and K4 can be compared and verified in respect of the qualityof treatment and the like.

This apparatus can transport wafers W through two transport paths R2 andR3 as shown in FIG. 3. The transport path R3 is for transporting wafersW between the same (lower) stories K3 and K4 of the treating blocks Baand Bb. The story K2 is included in neither of the transport paths R2and R3. Such transport paths R2 and R3 are effective when treating units(e.g. developing units DEV) on the story K2 cannot treat wafers W, orwhen the main transport mechanism on the story K2 cannot transportwafers W (i.e. in an abnormal state). The transport paths R2 and R3allow the wafers W to receive the treatment for forming resist film onthe different stories K1 and K3, and receive the developing treatment onthe same story K4. This is effective also in that, by carrying out aseries of treatments for the wafer W through such transport paths R2 andR3, the stories K1 and K3 can be compared and verified in respect of thequality of treatment and the like.

Further, this apparatus can transport wafers W through two transportpaths R4 and R5 as shown in FIG. 4. The transport path R4 is fortransporting wafers W from the story K3 to the story K4, and from thestory K4 to the story K1. The transport path R5 is for transportingwafers W from the story K3 to the story K4, and from the story K2 to thestory K1. Therefore, as seen, the wafers W are transported in onedirection on each of the stories K1 and K3 of the coating block Ba.Specifically, the story K3 of the coating block Ba receives wafers Wexclusively from the ID section 1, and feeds the wafers W exclusively tothe developing block Bb (story K4). The story K1 of the coating block Bareceives wafers W exclusively from the developing block Bb, and feedsthe wafers W exclusively to the ID section 1. Since the coating block Bacarries out treatment before the wafers W are exposed, this treatment iscarried out only on the story K3 where the wafers W before exposure aretransported exclusively. Such transport paths R4 and R5 are effectivewhen the treating units on the story K1 cannot treat wafers W. That is,the main transport mechanism on the story K1 is operated to transportwafers W from the developing block Bb to the ID section 1, thereby toease the burden of the main transport mechanism on the story K3, andincrease the throughput of the entire apparatus.

In this invention, the paths r for transporting wafers W between thetreating blocks Ba and Bb are not limited to the four transport pathsr1-r4 noted hereinbefore. That is, the paths may be any three of thetransport paths r1-r4. The transport paths r1, r2 and r3 are sufficientfor the example of operation illustrated in FIG. 2 through 4. Further,the transport paths r3 and r4 can transport wafers W only in one way,besides being capable of transporting wafers W bidirectionally. In theexample of operation illustrated in FIG. 4, for example, the transportpath r3 may transport wafers W only in one direction from the developingblock Bb to the coating block Ba.

The construction of each component of this embodiment will be describedin greater detail hereinafter.

FIG. 5 is a plan view showing an outline of the substrate treatingapparatus according to this embodiment. FIGS. 6 and 7 are schematic sideviews showing an arrangement of the treating units included in thesubstrate treating apparatus. FIGS. 8 through 11 are views in verticalsection taken on lines a-a, b-b, c-c and d-d of FIG. 5, respectively.

ID Section 1

The ID section 1 takes wafers W out of each cassette C, which stores aplurality of wafers W, and deposits wafers W in the cassette C. The IDsection 1 has a cassette table 9 for receiving cassettes C. The cassettetable 9 can receive four cassettes C as arranged in a row. The IDsection 1 has also an ID transport mechanism T_(ID). The ID transportmechanism T_(ID) transports wafers W to and from each cassette C, andtransports wafers W to and from receivers PASS₁ and PASS₃ to bedescribed hereinafter. The ID transport mechanism T_(ID) has a movablebase 21 for moving horizontally alongside the cassette table 9 in thedirection of arrangement of the cassettes C, a lift shaft 23 verticallyextendible and contractible relative to the movable base 21, and aholding arm 25 swivelable on the lift shaft 23, and extendible andretractable radially of the swivel motion, for holding a wafer W. The IDtransport mechanism T_(ID) corresponds to the indexer's transportmechanism in this invention.

Treating Section 3

As shown in FIGS. 5, 8 and others, main transport mechanisms T₁ and T₃are arranged on the stories K1 and K3 of the coating block Ba,respectively. Main transport mechanisms T₂ and T₄ are arranged on thestories K2 and K4 of the developing block Bb, respectively. The treatingblocks Ba and Bb will be described separately hereinafter.

Treating Section 3—Coating Block Ba

Receivers PASS₁ and PASS₃ for receiving wafers W are provided betweenthe ID section 1 and the respective stories K1 and K3 of the treatingblock Ba. The receiver PASS₁ receives, as placed thereon, wafers Wpassed between the ID transport mechanism T_(ID) and the main transportmechanism T₁. Similarly, the receiver PASS₃ receives, as placed thereon,wafers W passed between the ID transport mechanism T_(ID) and the maintransport mechanism T₃. Seen in a sectional view, the receiver PASS₁ isdisposed at a height adjacent a lower part of the upper story K2, whilethe receiver PASS₃ is disposed at a height adjacent an upper part of thelower story K3. Thus, the positions of receiver PASS₁ and receiver PASS₃are relatively close to each other for allowing the ID transportmechanism T_(ID) to move between the receiver PASS₁ and receiver PASS₃through using only a small amount of vertical movement.

Receivers PASS₂ and PASS₄ for receiving wafers W are fixedly providedfor the respective stories K between the treating blocks Ba and Bb.Specifically, the receiver PASS₂ is disposed between the story K1 andstory K2, and the receiver PASS₄ between the story K3 and story K4. Themain transport mechanisms T₁ and T₂ transfer wafers W through thereceiver PASS₂, and the main transport mechanisms T₃ and T₄ through thereceiver PASS₄. Thus, the receivers PASS₂ and PASS₄ are used totransport wafers W between the same stories. The receivers PASS₂ andPASS₄ correspond to the fixed receivers in this invention.

Further provided between the treating blocks Ba and Bb is a movablereceiver MPASS for receiving wafers W, which is vertically movablebetween the upper and lower stories. Specifically, the movable receiverMPASS is vertically movable by a drive mechanism (not shown) between thereceiver PASS₂ and receiver PASS₄. The movable receiver MPASS is movablebetween a height position corresponding to the story K1 (K2) and aheight position corresponding to the story K3 (K4). The height positioncorresponding to the story K1 (K2) is slightly lower than the receiverPASS₂, which is shown in solid lines in FIG. 8. The height positioncorresponding to the story K3 (K4) is slightly higher than the receiverPASS₄, which is shown in dotted lines in FIG. 8. The main transportmechanism T₁ and main transport mechanism T₂ can place wafers W on themovable receiver MPASS having moved to the height position correspondingto the story K1 (K2), and can receive wafers W therefrom (that is,wafers W can be transported). Similarly, the main transport mechanism T₃and main transport mechanism T₄ can transport wafers W to and from themovable receiver MPASS having moved to the height position correspondingto the story K3 (K4). Although usable to transport wafers W between thesame stories, the movable receiver MPASS is used exclusively totransport wafers W between the different stories in this embodiment.

The receiver PASS₁ includes a plurality of receivers (two in thisembodiment). These receivers PASS₁ are arranged vertically adjacent eachother. Similarly, each of the receivers PASS₂-PASS₄, each of receiversPASS₅ and PASS₆ to be described hereinafter, and the movable receiverMPASS, includes a plurality of receivers (two in this embodiment)arranged vertically adjacent each other. One of the pair of receiversPASS is selected according to a direction for transferring wafers W.

The receiver PASS₁, for example, has two receivers PASS_(1A) andPASS_(1B) arranged vertically adjacent each other. One of thesereceivers PASS_(1A) receives wafers W passed from the ID transportmechanism T_(ID) to the main transport mechanism T₁. The other receiverPASS_(1B) receives wafers W passed from the main transport mechanism T₁to the ID transport mechanism T_(ID).

The receiver PASS₂, for example, has two receivers PASS_(2A) andPASS_(2B). The main transport mechanism T₁ places wafers W on one ofthese receivers PASS_(2A), and the main transport mechanism T₂ receivesthese wafers W. The main transport mechanism T₂ places wafers W on theother receiver PASS_(2B), and the main transport mechanism T₁ receivesthese wafers W.

The movable receiver MPASS, for example, has movable receivers MPASS_(A)and MPASS_(B). The main transport mechanism T₁ or main transportmechanism T₃ places wafers W on one of these movable receiversMPASS_(A), and the main transport mechanism T₂ or main transportmechanism T₄ receives these wafers W. The main transport mechanism T₂ ormain transport mechanism T₄ places wafers W on the other movablereceiver MPASS_(B), and the main transport mechanism T₁ or maintransport mechanism T₃ receives these wafers W.

Each of the receivers PASS₁-PASS_(E) and movable receiver MPASS has aplurality of support pins projecting therefrom, for receiving a wafer Win a substantially horizontal position on these support pins. Each ofthe receivers PASS₁-PASS_(E) and movable receiver MPASS has also asensor (not shown) for detecting presence or absence of a wafer W.Detection signals of each sensor are inputted to a control section 90described hereinafter. Based on the detection signals of each sensor,the control section 90 determines whether or not a wafer W is placed onthe receiver PASS or MPASS, and controls the main transport mechanisms Tin transferring wafers W through the receiver PASS or MPASS.

The story K1 will now be described. The treating units on the story K1are coating units 31 and heat-treating units 41 for forming resist filmon wafers W. The main transport mechanism T₁ transports the wafers W toand from the coating units 31 and heat-treating units 41. The maintransport mechanism T₁ is movable in a transporting space A1 extendingsubstantially through the center of the story K1 and parallel to thedirection of transport. The coating units 31 are arranged on one side ofthe transporting space A₁, while the heat-treating units 41 are arrangedon the other side thereof.

The coating units 31 are arranged vertically and horizontally, eachfacing the transporting space A₁. In this embodiment, four coating units31 in total are arranged in two columns and two rows.

The coating units 31 include anti-reflection film coating units BARC forforming anti-reflection film on the wafers W, and resist film coatingunits RESIST for forming resist film on the wafers W (i.e. carrying outresist film forming treatment).

The anti-reflection film coating units BARC apply a treating solutionfor anti-reflection film to the wafers W. The resist film coating unitsRESIST apply a resist film material to the wafers W. The plurality of(two) anti-reflection film coating units BARC are arranged atsubstantially the same height in the lower row. The plurality of (two)resist film coating units RESIST are arranged at substantially the sameheight in the upper row. No dividing wall or partition is providedbetween the anti-reflection film coating units BARC. That is, all theanti-reflection film coating units BARC are only housed in a commonchamber, and the atmosphere around each anti-reflection film coatingunit BARC is not blocked off (i.e. is in communication). Similarly, theatmosphere around each resist film coating unit RESIST is not blockedoff.

Reference is made to FIGS. 12A and 12B. FIG. 12A is a plan view of thecoating units 31. FIG. 12B is a sectional view of a coating unit 31.Each coating unit 31 includes a spin holder 32 for holding and spinninga wafer W, a cup 33 surrounding the wafer W, and a supply device 34 forsupplying a treating solution to the wafer W.

The supply device 34 includes a plurality of nozzles 35, a gripper 36for gripping one of the nozzles 35, and a nozzle moving mechanism 37 formoving the gripper 36 to move one of the nozzles 35 between a treatingposition above the wafer W and a standby position away from above thewafer W. Each nozzle 35 has one end of a treating solution pipe 38connected thereto. The treating solution pipe 38 is arranged movable(flexible) to permit movement of the nozzle 35 between the standbyposition and treating position. The other end of each treating solutionpipe 38 is connected to a treating solution source (not shown).Specifically, in the case of anti-reflection film coating units BARC,the treating solution sources supply different types of treatingsolution for anti-reflection film to the respective nozzles 35. In thecase of resist film coating units RESIST, the treating solution sourcessupply different types of resist film material to the respective nozzles35.

The nozzle moving mechanism 37 has first guide rails 37 a and a secondguide rail 37 b. The first guide rails 37 a are arranged parallel toeach other and opposed to each other across the two cups 33 arrangedsideways. The second guide rail 37 b is slidably supported by the twofirst guide rails 37 a and disposed above the two cups 33. The gripper36 is slidably supported by the second guide rail 37 b. The first guiderails 37 a and second guide rail 37 b take guiding action substantiallyhorizontally and in directions substantially perpendicular to eachother. The nozzle moving mechanism 37 further includes drive members(not shown) for sliding the second guide rail 37 b, and sliding thegripper 36. The drive members are operable to move the nozzle 35 grippedby the gripper 36 to the treating positions above the two spin holders32.

The plurality of heat-treating units 41 are arranged vertically andhorizontally, each facing the transporting space A₁. In this embodiment,three heat-treating units 41 can be arranged horizontally, and fiveheat-treating units 41 can be stacked vertically. Each heat-treatingunit 41 has a plate 43 for receiving a wafer W. The heat-treating units41 include cooling units CP for cooling wafers W, heating and coolingunits PHP for carrying out heating and cooling treatments continually,and adhesion units AHL for heat-treating wafers W in an atmosphere ofhexamethyldisilazane (HMDS) vapor in order to promote adhesion ofcoating film to the wafers W. As shown in FIG. 5, each heating andcooling unit PHP has two plates 43, and a local transport mechanism (notshown) for moving a wafer W between the two plates 43. The various typesof heat-treating units CP, PHP and AHL are arranged in appropriatepositions.

The main transport mechanism T₁ will be described specifically.Reference is made to FIG. 13. FIG. 13 is a perspective view of the maintransport mechanism T₁. The main transport mechanism T₁ has two thirdguide rails 51 for providing vertical guidance, and a fourth guide rail52 for providing horizontal guidance. The third guide rails 51 are fixedopposite each other at one side of the transporting space A₁. In thisembodiment, the third guide rails 51 are arranged at the side adjacentto the coating units 31. The fourth guide rail 52 is slidably attachedto the third guide rails 51. The fourth guide rail 52 has a base 53slidably attached thereto. The base 53 extends transversely,substantially to the center of the transporting space A₁. Further, drivemembers (not shown) are provided for vertically moving the fourth guiderail 52, and horizontally moving the base 53. The drive members areoperable to move the base 53 to positions for accessing the coatingunits 31 and heat-treating units 41 arranged vertically andhorizontally.

The base 53 has a turntable 55 rotatable about a vertical axis Q. Theturntable 55 has two holding arms 57 a and 57 b horizontally movablyattached thereto for holding wafers W, respectively. The two holdingarms 57 a and 57 b are arranged vertically close to each other. Further,drive members (not shown) are provided for rotating the turntable 55,and extending and retracting the holding arms 57 a and 57 b. The drivemembers are operable to move the turntable 55 to positions opposed tothe coating units 31, heat-treating units 41, receivers PASS₁ and PASS₂,and movable receiver MPASS, having moved to the height positioncorresponding to the story K1 (K2), and to extend and retract theholding arms 57 a and 57 b to and from the coating units 31 and so on.

The story K3 will be described next. Like reference numerals are used toidentify like parts which are the same as in the story K1, and will notbe described again. The layout (arrangement) in plan view of the maintransport mechanism T₃ and various treating units on the story K3 issubstantially the same as on the story K1. Thus, the arrangement of thevarious treating units of the story K3 as seen from the main transportmechanism T₃ is substantially the same as the arrangement of the varioustreating units of the story K1 as seen from the main transport mechanismT₁. The coating units 31 and heat-treating units 41 of the story K3 arestacked under the coating units 31 and heat-treating units 41 of thestory K1, respectively.

In the following description, when distinguishing the resist filmcoating units RESIST in the stories K1 and K3, subscripts “1” and “3”will be affixed (for example, the resist film coating units RESIST inthe story K1 will be referred to as “resist film coating unitsRESIST₁”).

The other aspects of the treating block Ba will be described. As shownin FIGS. 8 and 9, each of the transporting spaces A₁ and A₃ has a firstblowout unit 61 for blowing out a clean gas, and an exhaust unit 62 forsucking in the gas. Each of the first blowout unit 61 and exhaust unit62 is in the form of a flat box having substantially the same area asthe transporting space A₁ in plan view. Each of the first blowout unit61 and exhaust unit 62 has first blowout openings 61 a or exhaustopenings 62 a formed in one surface thereof. In this embodiment, thefirst blowout openings 61 a or exhaust openings 62 a are in the form ofnumerous small bores f (see FIG. 13). The first blowout units 61 arearranged over the transporting spaces A₁ and A₃ with the first blowoutopenings 61 a directed downward. The exhaust units 62 are arranged underthe transporting spaces A₁ and A₃ with the exhaust openings 62 adirected upward. The atmosphere in the transporting space A₁ and theatmosphere in the transporting space A₃ are blocked off by the exhaustunit 62 of the transporting space A₁ and the first blowout unit 61 ofthe transporting space A₃. Thus, each of the stories K1 and K3 has theatmosphere blocked off from the other.

Referring to FIG. 9, the first blowout units 61 of the transportingspaces A₁ and A₃ are connected to a common, first gas supply pipe 63.The first gas supply pipe 63 extends laterally of the receivers PASS₂and PASS₄ from an upper position of the transporting space A₁ to a lowerposition of the transporting space A₃, and is bent below thetransporting space A₃ to extend horizontally. The other end of the firstgas supply pipe 63 is connected to a gas source not shown. Similarly,the exhaust units 62 of the transporting spaces A₁ and A₃ are connectedto a common, first gas exhaust pipe 64. The first gas exhaust pipe 64extends laterally of the receivers PASS₂ and PASS₄ from a lower positionof the transporting space A₁ to a lower position of the transportingspace A₃, and is bent below the transporting space A₃ to extendhorizontally. As the gas is blown out of each first blowout opening 61 aand sucked and exhausted through each exhaust opening 62 a of thetransporting spaces A₁ and A₃, gas currents are formed to flow from topto bottom of the transporting spaces A₁ and A₃, thereby keeping each ofthe transporting spaces A₁ and A₃ in a clean state.

As shown in FIGS. 5, 10 and 12A, each coating unit 31 of the stories K1and K3 has a pit portion PS extending vertically. The pit portion PSaccommodates a second gas supply pipe 65 extending vertically forsupplying the clean gas, and a second gas exhaust pipe 66 extendingvertically for exhausting the gas. Each of the second gas supply pipe 65and second gas exhaust pipe 66 branches at a predetermined height ineach coating unit 31 to extend substantially horizontally from the pitportion PS. A plurality of branches of the second gas supply pipe 65 areconnected to second blowout units 67 for blowing out the gas downward. Aplurality of branches of the second gas exhaust pipe 66 are connectedfor communication to the bottoms of the respective cups 33. The otherend of the second gas supply pipe 65 is connected to the first gassupply pipe 63 below the story K3. The other end of the second gasexhaust pipe 66 is connected to the first gas exhaust pipe 64 below thestory K3. As the gas is blown out of the second blowout units 67 andexhausted through the second exhaust pipes 62 a, the atmosphere insideeach cup 33 is constantly maintained clean, thereby allowing forexcellent treatment of the wafer W held by the spin holder 32.

The pit portions PS further accommodate piping of the treatingsolutions, electric wiring and the like (not shown). Thus, with the pitportions PS accommodating the piping and electric wiring provided forthe coating units 31 of the stories K1 and K3, the piping and electricwiring can be reduced in length.

The treating block Ba has one housing 75 for accommodating the maintransport mechanisms T₁ and T₃, coating units 31 and heat-treating units41 described hereinbefore. The treating block Bb described hereinafteralso has a housing 75 for accommodating the main transport mechanisms T₂and T₄ and the various treating units of the treating block Bb. Thehousing 75 of the treating block Ba and the housing 75 of the treatingblock Bb are separate entities. Thus, with each of the treating blocksBa and Bb having the housing 75 accommodating the main transportmechanisms T and various treating units en bloc, the treating section 3may be manufactured and assembled simply. The main transport mechanismsT₁ and T₃ correspond to the first main transport mechanisms in thisinvention.

Treating Section 3—Developing Block Bb

The story K2 will be described. Like reference numerals are used toidentify like parts which are the same as in the story K1 and will notbe described again. The story K2 has a transporting space A2 formed asan extension of the transporting space A₁.

The treating units on the story K2 are developing units DEV fordeveloping wafers W, heat-treating units 42 for heat-treating the wafersW, and an edge exposing unit EEW for exposing peripheral regions of thewafers W. The developing units DEV are arranged at one side of thetransporting space A₂, and the heat-treating units 42 and edge exposingunit EEW are arranged at the other side of the transporting space A₂.Preferably, the developing units DEV are arranged at the same side asthe coating units 31. It is also preferable that the heat-treating units42 and edge exposing unit EEW are arranged in the same row as theheat-treating units 41.

The number of developing units DEV is four, and sets of two units DEVarranged horizontally along the transporting space A₂ are stacked oneover the other. As shown in FIGS. 5 and 10, each developing unit DEVincludes a spin holder 77 for holding and spinning a wafer W, and a cup79 surrounding the wafer W. The two developing units DEV arranged at thelower level are not separated from each other by a partition wall or thelike. A supply device 81 is provided for supplying developers to the twodeveloping units DEV. The supply device 81 includes two slit nozzles 81a having a slit or a row of small bores for delivering the developers.The slit or row of small bores, preferably, has a length correspondingto the diameter of wafer W. Preferably, the two slit nozzles 81 a arearranged to deliver developers of different types or concentrations. Thesupply device 81 further includes a moving mechanism 81 b for movingeach slit nozzle 81 a. Thus, the slit nozzles 81 a are movable,respectively, over the two spin holders 77 juxtaposed sideways.

The plurality of heat-treating units 42 are arranged sideways along thetransporting space A₂, and stacked one over the other. The heat-treatingunits 42 include heating units HP for heating wafers W, cooling units CPfor cooling wafers W, and heating and cooling units PHP for successivelycarrying out heating treatment and cooling treatment.

The plurality of heating and cooling units PHP are vertically stacked inthe column closest to the IF section 5, each having one side facing theIF section 5. The heating and cooling units PHP on the story K2 havetransport ports formed in the sides thereof for passage of wafers W. IFtransport mechanisms T_(IF) to be described hereinafter transport wafersW through the above transport ports to the heating and cooling unitsPHP. The heating and cooling units PHP arranged on the story K2 carryout post-exposure baking (PEB) treatment for exposed wafers W.Similarly, the heating and cooling units PHP arranged on the story K4carry out post-exposure baking (PEB) treatment for exposed wafers W.

The single edge exposing unit EEW is disposed in a predeterminedposition. The edge exposing unit EEW includes a spin holder (not shown)for holding and spinning a wafer W, and a light emitter (not shown) forexposing edges of the wafer W held by the spin holder.

The receiver PASS₅ is formed on top of the heating and cooling units PHPon the story K2. Through the receiver PASS₅, the main transportmechanism T₂ and IF transport mechanisms T_(IF) to be describedhereinafter transfer wafers W.

The main transport mechanism T₂ is disposed substantially centrally ofthe transporting space A₂ in plan view. The main transport mechanism T₂has the same construction as the main transport mechanism T₁. The maintransport mechanism T₂ transports wafers W to and from the receiverPASS₂, movable receiver MPASS having moved to the height positioncorresponding to the story K1 (K2), developing units DEV, variousheat-treating units 42, edge exposing unit EEW and receiver PASS₅.

The story K4 will be described briefly. The relationship in constructionbetween story K2 and story K4 is similar to that between stories K1 andK3. The treating units U on the story K4 are developing units DEV,heat-treating units 42 and an edge exposing unit EEW. The heat-treatingunits 42 on the story K4 include heating units HP, cooling units CP andheating and cooling units PHP. The receiver PASS₆ is formed on top ofthe heating and cooling units PHP on the story K4. The main transportmechanism T₄ and IF transport mechanisms T_(IF) described hereinaftertransfer wafers W through the receiver PASS₆. The heating and coolingunits PHP on the story K4 also correspond to the PEB units in thisinvention.

In the following description, when distinguishing the developing unitsDEV, edge exposing units EEW and so on provided on the stories K2 andK4, subscripts “2” and “4” will be affixed (for example, the heatingunits HP on the story K2 will be referred to as “heating units HP₂”).

Each of the transporting spaces A₂ and A₄ of the stories K2 and K4 alsohas constructions corresponding to the first blowout unit 61 and exhaustunit 62. Each developing unit DEV of the stories K2 and K4 also hasconstructions corresponding to the second blowout unit 67 and second gasexhaust pipe 66.

Each of the main transport mechanism T₂ and main transport mechanism T₄corresponds to the second main transport mechanism in this invention.

IF Section 5

The IF section 5 transfers wafers W between the treating section 3 (moreparticularly, the stories K2 and K4 of the developing block Bb) and theexposing machine EXP. The IF section 5 has IF transport mechanismsT_(IF) for transporting wafers W. IF transport mechanisms T_(IF) includean IF first transport mechanism T_(IFA) and an IF second transportmechanism T_(IFB) that can transfer wafers W to and from each other. IFfirst transport mechanism T_(IFA) transports wafers W mainly to and fromthe developing block Bb. IF second transport mechanism T_(IFB)transports wafers W mainly to and from the exposing machine EXP.

As shown in FIG. 5, IF first transport mechanism T_(IFA) and IF secondtransport mechanism T_(IFB) are arranged in a transverse directionsubstantially perpendicular to the direction of arrangement of the maintransport mechanisms T on each story. IF first transport mechanismT_(IFA) is disposed at the side where the heat-treating units 42 and soon of the treating block Bb are located. IF second transport mechanismT_(IFB) is disposed at the side where the developing units DEV of thetreating block Bb are located.

As shown in FIG. 11, IF first transport mechanism T_(IFA) includes afixed base 83, lift shafts 85 vertically extendible and contractiblerelative to the base 83, and a holding arm 87 swivelable on the liftshafts 85, and extendible and retractable radially of the swivel motion,for holding a wafer W. IF second transport mechanism T_(IFB) also has abase 83, lift shafts 85 and a holding arm 87.

Stacked in multiples stages between IF first and second transportmechanisms T_(IFA) and T_(IFB) are a receiver PASS-CP for receiving andcooling wafers W, a receiver PASS₇ for receiving wafers W, and buffersBF_(IF) for temporarily storing wafers W. The buffers BF_(IF) aredivided into a send buffer BF_(IFS) for temporarily storing wafers W tobe sent to the exposing machine EXP, and a return buffer BF_(IFR) fortemporarily storing wafers W to be returned to the treating section 3.The return buffer BF_(IFR) stores exposed wafers W having receivedpost-exposure baking (PEB) treatment.

IF first transport mechanism T_(IFA) transports wafers W to and from thereceivers PASS₅ and PASS_(E), heating and cooling units PHP on thestories K2 and K4, receiver PASS-CP, receiver PASS₇ and buffer BF_(IF).IF second transport mechanism T_(IFB) transports wafers W to and fromthe exposing machine EXP, receiver PASS-CP and receiver PASS₇. IF firstand second transport mechanisms T_(IFA) and T_(IFB) transfer wafers Wtherebetween through the receiver PASS-CP and receiver PASS₇. IFtransport mechanisms T_(IF) correspond to the interface's transportmechanisms in this invention.

A control system of this apparatus will be described next. FIG. 14 is acontrol block diagram of the substrate treating apparatus according tothe invention. As shown, the control section 90 of this apparatusincludes a main controller 91 and first to seventh controllers 93, 94,95, 96, 97, 98 and 99.

The main controller 91 performs overall control of the first to seventhcontrollers 93-99. Further, the main controller 91 can communicatethrough a host computer with an exposing machine controller provided forthe exposing machine EXP. The first controller 93 controls substratetransport by the ID transport mechanism T_(ID). The second controller 94controls substrate transport by the main transport mechanism T₁, andsubstrate treatment in the resist film coating units RESIST₁,anti-reflection film coating units BARC₁, cooling units CP₁, heating andcooling units PHP₁ and adhesion units AHL₁. The third controller 95controls substrate transport by the main transport mechanism T₂, andsubstrate treatment in the edge exposing unit EEW₂, developing unitsDEV₂, heating units HP₂ and cooling units CP₂. The controls by thefourth and fifth controllers 96 and 97 correspond to those by the secondand third controllers 94 and 95, respectively. The sixth controller 98controls substrate transport by IF first transport mechanism T_(IFA),and substrate treatment in the heating and cooling units PHP₂ and PHP₄.The seventh controller 99 controls substrate transport by IF secondtransport mechanism T_(IFB). Further, each of the second to fifthcontrollers 94-97 controls vertical movement of the movable receiverMPASS. The first to seventh controllers 93-99 carry out the controlsindependently of one another.

Each of the main controller 91 and the first to seventh controllers93-99 is realized by a central processing unit (CPU) which performsvarious processes, a RAM (Random Access Memory) used as the workspacefor operation processes, and a storage medium such as a fixed disk forstoring a variety of information including a predetermined processingrecipe (processing program). The processing recipe includes alsoinformation on the transport paths for transporting wafers W.

Next, operation of the substrate treating apparatus in this embodimentwill be described. The examples of operation according to the varioustransport paths shown in FIGS. 2 through 4 are realized by combinationsof operation of the respective transport mechanisms. Therefore, thefollowing description will be made separately for each transportmechanism. FIG. 15 is a flow chart of a series of treatments of wafersW, indicating the treating units and receivers to which the wafers W aretransported in order. FIG. 16 is a view schematically showing operationsrepeated by each transport mechanism, and specifying an order oftreating units, receivers and cassettes accessed by the transportmechanisms.

ID Transport Mechanism T_(ID)

The ID transport mechanism T_(ID) moves to a position opposed to one ofthe cassettes C, holds with the holding arm 25 a wafer W to be treatedand takes the wafer W out of the cassette C. The ID transport mechanismT_(ID) swivels the holding arm 25, vertically moves the lift shaft 23,moves to a position opposed to the receiver PASS₁, and places the waferW on the receiver PASS_(1A) (which corresponds to step S1 a in FIG. 15;only step numbers will be indicated hereinafter). At this time, a waferW usually is present on the receiver PASS_(1B), and the ID transportmechanism T_(ID) receives this wafer W and stores it in a cassette C(step S23). When there is no wafer W on the receiver PASS_(1B), step S23is omitted. Then, the ID transport mechanism T_(ID) accesses thecassette C, and transports a wafer W from the cassette C to the receiverPASS_(3A) (step S1 b). Here again, if a wafer W is present on thereceiver PASS_(3B), the ID transport mechanism T_(ID) will store thiswafer W in a cassette C (step S23). The ID transport mechanism T_(ID)repeats the above operation.

This operation of the ID transport mechanism T_(ID) is controlled by thefirst controller 93. As a result, the wafers W in the cassette C are fedto the story K1, and the wafers W delivered from the story K1 are storedin the cassette C. Similarly, the wafers W in the cassette C are fed tothe story K3, and the wafers W delivered from the story K3 are stored inthe cassette C.

Main Transport Mechanisms T₁, T₃

Since operation of the main transport mechanism T₃ is substantially thesame as operation of the main transport mechanism T₁, only the maintransport mechanism T₁ will be described. That is, operation on thestory K1 will be described. The main transport mechanism T₁ moves to aposition opposed to the receiver PASS₁. At this time, the main transportmechanism T₁ holds, on one holding arm 57 (e.g. 57 b), a wafer Wreceived immediately before from the receiver PASS_(2B). The maintransport mechanism T₁ places this wafer W on the receiver PASS_(1B)(step S22), and holds the wafer W present on the receiver PASS_(1A) withthe other holding arm 57 (e.g. 57 a).

The main transport mechanism T₁ accesses a predetermined one of thecooling units CP₁. There is a different wafer W having already receiveda predetermined heat treatment (cooling) in the cooling unit CP₁. Themain transport mechanism T₁ holds the different wafer W with theunloaded holding arm 57 (holding no wafer W), takes it out of thecooling unit CP₁, and loads into the cooling unit CP₁ the wafer W havingbeen received from the receiver PASS_(1A). Then, the main transportmechanism T₁, holding the cooled wafer W, moves to one of theanti-reflection film coating units BARC₁. The cooling unit CP₁ startsheat treatment (cooling) of the wafer W loaded therein (step S2). Thefollowing description assumes that wafers W having receivedpredetermined treatments are present also in the other, differentheat-treating units 41 and coating units 31 when the main transportmechanism T₁ makes access thereto.

Accessing the anti-reflection film coating unit BARC₁, the maintransport mechanism T₁ takes a wafer W having anti-reflection filmformed thereon from the anti-reflection film coating unit BARC₁, andplaces the cooled wafer W on the spin holder 32 of the anti-reflectionfilm coating unit BARC₁. Then, the main transport mechanism T₁, holdingthe wafer W having anti-reflection film formed thereon, moves to one ofthe heating and cooling units PHP₁. The anti-reflection film coatingunit BARC₁ starts treatment of the wafer W placed on the spin holder 32(step S3).

Specifically, the spin holder 32 spins the wafer W in horizontalposture, the gripper 26 grips one of the nozzles 35, the nozzle movingmechanism 37 moves the gripped nozzle 35 to a position above the waferW, and the treating solution for anti-reflection film is supplied fromthe nozzle 35 to the wafer W. The treating solution supplied spreads allover the wafer W, and is scattered away from the wafer W. The cup 33collects the scattering treating solution. In this way, the treatment iscarried out for forming anti-reflection film on the wafer W.

Accessing the heating and cooling unit PHP₁, the main transportmechanism T₁ takes a wafer W having received heat treatment out of theheating and cooling unit PHP₁, and loads the wafer W havinganti-reflection film formed thereon into the heating and cooling unitPHP₁. Then, the main transport mechanism T₁, holding the wafer W takenout of the heating and cooling unit PHP₁, moves to one of the coolingunits CP₁. The heating and cooling unit PHP₁ receives a wafer Wsuccessively on the two plates 43, to heat the wafer W on one of theplates 43 and then to cool the wafer W on the other plate 43 (step S4).

Having moved to the cooling unit CP₁, the main transport mechanism T₁takes a wafer W out of the cooling unit CP₁, and loads the wafer W heldby the transport mechanism T₁ into the cooling unit CP₁. The coolingunit CP₁ cools the wafer W loaded therein (step S5).

Then, the main transport mechanism T₁ moves to one of the resist filmcoating units RESIST₁. The main transport mechanism T₁ takes a wafer Whaving resist film formed thereon from the resist film coating unitRESIST₁, and loads the wafer W held by the main transport mechanism T₁into the resist film coating unit RESIST₁. The resist film coating unitRESIST₁ supplies the resist film material while spinning the wafer Wloaded therein, to form resist film on the wafer W (step S6).

The main transport mechanism T₁ further moves to one of the heating andcooling units PHP₁ and one of the cooling units CP₁. The main transportmechanism T₁ loads the wafer W having resist film formed thereon intothe heating and cooling unit PHP₁, transfers a wafer W treated in theheating and cooling unit PHP₁ to the cooling unit CP₁, and receives awafer W treated in the cooling unit CP₁. The heating and cooling unitPHP₁ and cooling unit CP₁ carry out predetermined treatments of newlyloaded wafers W, respectively (steps S7 and S8).

The main transport mechanism T₁, depending on a transport path for thewafer W it is holding, transports the wafer W to the receiver PASS₂ ormovable receiver MPASS. As a result, this wafer W is fed from thecoating block Ba (story K1) to either the story K2 or story K4 of thedeveloping block Bb. The transport path for the wafer W held is set tothe processing recipe beforehand.

Specifically, the following action takes place. When transporting thewafer W from the story K1 to the story K2 (corresponding to r1 in FIG.1), the main transport mechanism T₁ moves to the position opposed to thereceiver PASS₂. Then, the main transport mechanism T₁ places the wafer Wit is holding on the receiver PASS_(2A) (step S9 a).

When transporting the wafer W from the story K1 to the story K4(corresponding to r3 in FIG. 1), the movable receiver MPASS moves to theheight position corresponding to the story K1 (K2), and the maintransport mechanism T₁ moves to the position opposed to the movablereceiver MPASS. Then, the main transport mechanism T₁ places the wafer Wit is holding on the movable receiver MPASS_(A) (step S9 c). When thewafer W has been placed on the movable receiver MPASS_(A), the lattermoves down to the position corresponding to the destination story K3(K4).

Then, depending on a transport path for a wafer W to receive from thedeveloping block Bb, the main transport mechanism T₁ receives the waferW present on the receiver PASS₂ or movable receiver MPASS. The transportpath for this wafer W also is set to the processing recipe beforehand.

Specifically, the following action takes place. When the story K1 is toreceive a wafer W fed from the story K2 (corresponding to r1 in FIG. 1),the main transport mechanism T₁ receives the wafer W present on thereceiver PASS_(2B) (step S21 a). When the story K1 is to receive a waferW fed from the story K4 (corresponding to r3 in FIG. 1), the maintransport mechanism T₁ receives the wafer W present on the movablereceiver MPASS_(B) (step S21 c).

Subsequently, the main transport mechanism T₁ accesses the receiverPASS₁ again, and repeats the above operation. This operation iscontrolled by the second controller 94. As a result, the main transportmechanism T₁ receives a wafer W from the receiver PASS₁ and transportsthe wafer W to a predetermined treating unit (a cooling unit CP 1 inthis embodiment), and takes a treated wafer W from this treating unit.Subsequently, the main transport mechanism T₁ transports the wafer Wtaken out to a different treating unit, and takes a treated wafer W fromthe different treating unit. In this way, the treatment is carried outin parallel for a plurality of wafers W by transferring a treated waferW from each treating unit to a new treating unit. Starting with a waferW first placed on the receiver PASS₁, the wafers W are successivelytransported from the story K1 to the developing block Bb.

When transporting a wafer W from the story K1 to the developing blockBb, and feeding the wafer W to the same story K2 as the story K1, themain transport mechanism T₁ places the wafer W on the receiver PASS₂.When feeding the wafer W to the story K4 different from the story K1,the main transport mechanism T₁ places the wafer W on the movablereceiver MPASS.

When receiving a wafer W fed from the developing block Bb, a wafer W fedfrom the same story K2 as the story K1 is placed on the receiver PASS₂,and therefore the main transport mechanism T₁ receives the wafer W fromthe receiver PASS₂. Since a wafer W fed from the story K4 different fromthe story K1 is placed on the movable receiver MPASS, the main transportmechanism T₁ receives the wafer W from the movable receiver MPASS. Inthis way, the main transport mechanism T₁ feeds the wafer W receivedfrom either the receiver PASS₂ or movable receiver MPASS to the IDsection 1.

Main Transport Mechanisms T₂, T₄

Since operation of the main transport mechanism T₄ is substantially thesame as operation of the main transport mechanism T₂, only the maintransport mechanism T₂ will be described. That is, operation on thestory K2 will be described. Depending on a transport path for a wafer Wto receive from the coating block Ba, the main transport mechanism T₂receives the wafer W present on the receiver PASS₂ or movable receiverMPASS. The transport path for this wafer W also is set to the processingrecipe beforehand.

Specifically, the following action takes place. When receiving a wafer Wfed from the story K1 (corresponding to r1 in FIG. 1), the maintransport mechanism T₂ receives the wafer W present on the receiverPASS₂ (step S9 a). When receiving a wafer W fed from the story K3(corresponding to r4 in FIG. 1), the main transport mechanism T₂receives the wafer W present on the movable receiver MPASS_(A) (step S9c).

At this time, the main transport mechanism T₂ is holding a wafer Wreceived from a cooling unit CP₂ accessed immediately before. The maintransport mechanism T₂ places this wafer W on the receiver PASS₂ ormovable receiver MPASS, depending on a transport path for the wafer W.Specifically, when the wafer W is to be transported from the story K2 tothe story K1, the main transport mechanism T₂ places the wafer W on thereceiver PASS₂. When the wafer W is to be transported from the story K2to the story K3, the main transport mechanism T₂ places the wafer W onthe movable receiver MPASS. In this way, the wafer W is fed from thestory K2 to either the story K1 or story K3 of the coating block Ba.

Specifically, the following action takes place. When transporting thewafer W from the story K2 to the story K1 (corresponding to r1 in FIG.1), the main transport mechanism T₂ places the wafer W it is holding onthe receiver PASS_(2B) (step S21 a). When transporting the wafer W fromthe story K2 to the story K3 (corresponding to r4 in FIG. 1), the maintransport mechanism T₂ places the wafer W it is holding on the movablereceiver MPASS_(B) (step S21 c). When the wafer W has been placed on themovable receiver MPASS, the latter moves down to the positioncorresponding to the destination story K3 (K4).

After the substrate transport in step S9 a or S9 c, the main transportmechanism T₂ accesses the edge exposing unit EEW₂. Then, the maintransport mechanism T₂ receives a wafer W having undergone apredetermined treatment in the edge exposing unit EEW₂, and loads thecooled wafer W into the edge exposing unit EEW₂. While spinning thewafer W loaded therein, the edge exposing unit EEW₂ irradiatesperipheral regions of the wafer W with light from the light emitter notshown, thereby exposing the peripheral regions of the wafer W (stepS10).

The main transport mechanism T₂, holding the wafer W received from theedge exposing unit EEW₂, accesses the receiver PASS₅. The main transportmechanism T₂ places the wafer W on the receiver PASS_(5A) (step S11),and holds a wafer W present on the receiver PASS_(5B) (step S16).

The main transport mechanism T₂ moves to one of the cooling units CP₂,and replaces a wafer W in the cooling unit CP₂ with the wafer W held bythe main transport mechanism T₂. The main transport mechanism T₂ holdsthe wafer W having received cooling treatment, and accesses one of thedeveloping units DEV₂. The cooling unit CP₂ starts treatment of thenewly loaded wafer W (step S17).

The main transport mechanism T₂ takes a developed wafer W from thedeveloping unit DEV₂, and places the cooled wafer W on the spin holder77 of the developing unit DEV₂. The developing unit DEV₂ develops thewafer W placed on the spin holder 77 (step S18). Specifically, while thespin holder 77 spins the wafer W in horizontal posture, the developer issupplied from one of the slit nozzles 81 a to the wafer W, therebydeveloping the wafer W.

The main transport mechanism T₂ holds the developed wafer W, andaccesses one of the heating units HP₂. The main transport mechanism T₂takes a wafer W out of the heating unit HP₂, and loads the wafer W it isholding into the heating unit HP₂. Then, the main transport mechanism T₂transports the wafer W taken out of the heating unit HP₂ to one of thecooling units CP₂, and takes out a wafer W already treated in thiscooling unit CP₂. The heating unit HP₂ and cooling unit CP₂ carry outpredetermined treatments for the newly loaded wafers W, respectively(steps S19 and S20).

Subsequently, the main transport mechanism T₂ accesses the receiverPASS₂ and/or movable receiver MPASS again, and repeats the aboveoperation. This operation is controlled by the third controller 95. As aresult, the wafers W are forwarded to the receiver PASS_(5A) in theorder of receipt from the receiver PASS_(2A) or movable receiverMPASS_(A). Similarly, the wafers W are forwarded to the receiverPASS_(2B) or movable receiver MPASS_(B) in the order in which they areplaced on the receiver PASS_(5B).

At this time, the wafers W are fed through the receiver PASS₂ fortransport to the same story K1 as the story K2. The wafers W are fedthrough the movable receiver MPASS for transport to the story K4different from the story K2.

IF Transport Mechanisms T_(IF)—IF First Transport Mechanism T_(IFA)

IF first transport mechanism T_(IFA) accesses the receiver PASS₅, andreceives the wafer W present on the receiver PASS_(SA) (step S11 a). IFfirst transport mechanism T_(IFA), holding the wafer W received, movesto the receiver PASS-CP, and loads the wafer W on the receiver PASS-CP(step S12).

Next, IF first transport mechanism T_(IFA) receives a wafer W from thereceiver PASS₇ (step S14), and moves to a position opposed to one of theheating and cooling units PHP₂. IF first transport mechanism T_(IFA)takes a wafer W having received post-exposure baking treatment (PEB)treatment from the heating and cooling unit PHP₂, and loads the wafer Wreceived from the receiver PASS₇ into the heating and cooling unit PHP₂.The heating and cooling unit PHP₂ carries out heat treatment for thenewly loaded wafer W (step S15 a).

IF first transport mechanism T_(IFA) transports the wafer W taken out ofthe heating and cooling unit PHP₂ to the receiver PASS_(SB).Subsequently, IF first transport mechanism T_(IFA) transports a wafer Wfrom the receiver PASS_(6A) to the receiver PASS-CP (Step S11 b, S12).Next, IF first transport mechanism T_(IFA) transports a wafer W from thereceiver PASS₇ to one of the heating and cooling units PHP₄. At thistime, IF first transport mechanism T_(IFA) takes out a wafer W havingreceived the post-exposure baking treatment (PEB) treatment in theheating and cooling unit PHP₄, and places the wafer W on the receiverPASS_(6B) (steps S14, S15 b, S16 b).

Subsequently, IF first transport mechanism T_(IFA) accesses the receiverPASS₅ again and repeats the above operation. This operation iscontrolled by the sixth controller 98.

IF Transport Mechanisms T_(IF)—IF Second Transport Mechanism T_(IFB)

IF second transport mechanism T_(IFB) takes a wafer W out of thereceiver PASS-CP, and transports it to the exposing machine EXP. Then,IF second transport mechanism T_(IFB) receives an exposed wafer W fromthe exposing machine EXP, and transports it to the receiver PASS₇ (stepS13).

Subsequently, IF second transport mechanism T_(IFB) accesses thereceiver PASS-CP again and repeats the above operation.

As described above, the substrate treating apparatus according to thefirst embodiment includes the movable receiver MPASS disposed betweenthe adjoining coating block Ba and developing block Bb to be verticallymovable between the upper story K1 (K2) and lower story K3 (K4). Thisallows wafers W to be transported between different stories of thecoating block Ba and developing block Bb.

Since the range of vertical movement of the movable receiver MPASScovers all the stories (the upper story and lower story in thisembodiment) of the treating blocks Ba and Bb, each of the stories K1 andK3 of the coating block Ba can transport wafers W to and from all thestories K2 and K4 of the developing block Bb. Conversely, each of thestories K2 and K4 of the developing block Bb can transport wafers W toand from all the stories K1 and K3 of the coating block Ba. That is, themovable receiver MPASS allows wafers W to be transported through fourpaths r1-r4 between the respective stories of the treating blocks Ba andBb. When the transport directions are considered, the number of paths iseight.

Since wafers W can be transported flexibly between the treating blocksBa and Bb as described above, even when one of the main transportmechanisms T falls into an abnormal state, the wafers W can betransported through the transport paths which do not include theabnormal main transport mechanism T. A series of treatments is carriedout for the wafers W by efficiently operating the normal main transportmechanisms T and the treating units. This can prevent a significantreduction in the throughput of this apparatus.

Since wafers W can be transported flexibly between the treating blocksBa and Bb, a flexible selection can be made from among the transportpaths for the wafers W of the entire apparatus described with referenceto FIGS. 2 to 4. This enables a comparison of the quality of treatmentbetween the stories K1 and K3 of the coating block Ba, and between thestories K2 and K4 of the developing block Bb.

Since the receivers PASS₂ and PASS₄ are fixedly provided between thetreating blocks Ba and Bb, wafers W can be transported between the samestories K1 and K2 and between the same stories K3 and K4 of the treatingblocks Ba and Bb. The burden and amount of movement of the movablereceiver MPASS can be reduced by using the movable receiver MPASSexclusively for transporting wafers W between different stories, andusing the receivers PASS₂ and PASS₄ exclusively for transporting wafersW between the same stories. As a result, wafers W can be transportedsmoothly even between the different stories of the treating blocks Baand Bb. The movable receiver MPASS can also be controlled with increasedease.

Second Embodiment

The second embodiment of this invention will be described with referenceto the drawings. In the second embodiment, the movable receiver MPASS isomitted from the substrate treating apparatus described in the firstembodiment, and the construction of the main transport mechanisms T₂ andT₄ in the developing block Bb described in the first embodiment has beenchanged. Thus, the following description will be made centering on maintransport mechanisms T_(2M) and T_(4M) of the second embodiment.

FIG. 17 is a view in vertical section of each transporting space in thesubstrate treating apparatus according to the second embodiment. Asseen, there is no first blowout unit 61 or exhaust unit 62 between thetransporting spaces A₂ and A₄ on the stories K2 and K4 of the developingblock Bb. Therefore, the transporting space A₂ and transporting space A₄are in communication.

Both the main transport mechanisms T_(2M) and T_(4M) are verticallymovably supported by a common strut 101. The main transport mechanismT_(2M) is disposed over the main transport mechanism T_(4M). The strut101 extends vertically from the upper end of the transporting space A₂to the lower end of the transporting space A₄. Each of the maintransport mechanisms T_(2M) and T_(4M) includes a lift member 103, abase 105, a turntable 55 and two holding arms 57 a and 57 b. The liftmember 103 is attached to the strut 101 to be vertically movable alongthe strut 101. The base 105 is connected to the lift member 103. Theturntable 55 is supported by the base 103 to be rotatable about avertical axis. The two holding arms 57 a and 57 b are horizontallyextendible and retractable relative to the turntable 55.

The main transport mechanism T_(2M) transports wafers W to and from thetreating units arranged on the story K2 and the receivers PASS₂ andPASS₅. Further, the main transport mechanism T_(2M) can descend to thestory K4 to transport wafers W to and from the receiver PASS₄. At thistime, the main transport mechanism T_(4M) moves to a lower position onthe story K4 to avoid interference with the main transport mechanismT_(2M). Thus, the main transport mechanism T_(2M) is constructedvertically movable between the stories K2 and K4 in the developing blockBb to transfer wafers W to and from the main transport mechanisms T₁ andT₃ on the stories K1 and K3 of the adjoining coating block Ba.

Similarly, the main transport mechanism T_(4M) transports wafers W toand from the treating units arranged on the story K4 and the receiversPASS₄ and PASS_(E). Further, the main transport mechanism T_(4M) canascend to the story K2 to transport wafers W to and from the receiverPASS₂. At this time, the main transport mechanism T_(2M) moves to anupper position on the story K2 to avoid interference with the maintransport mechanism T_(4M). Thus, the main transport mechanism T_(4M)also is constructed vertically movable between the stories K2 and K4 inthe developing block Bb to transfer wafers W to and from the maintransport mechanisms T₁ and T₃ on the stories K1 and K3 of the adjoiningcoating block Ba.

With the main transport mechanism T_(2M) transporting wafers W to andfrom the receiver PASS₄, the wafers W can be transported between thestory K2 and story K3 (corresponding to r4 in FIG. 1). With the maintransport mechanism T_(4M) transporting wafers W to and from thereceiver PASS₂, the wafers W can be transported between the story K1 andstory K4 (corresponding to r3 in FIG. 1).

Thus, with the substrate treating apparatus according to the secondembodiment, the main transport mechanism T_(2M) on the story K2 cantransfer wafers W to and from the main transport mechanism T₁ on thesame story K1 through the receiver PASS₂, and to and from the maintransport mechanism T₃ on the different story K3 through the receiverPASS₄. Similarly, the main transport mechanism T_(4M) on the story K4can transfer wafers W to and from the main transport mechanism T₃ on thesame story K3 through the receiver PASS₄, and to and from the maintransport mechanism T₁ on the different story K1 through the receiverPASS₂. Therefore, as in the first embodiment, wafers W can betransported through four paths r1-r4 between the respective stories ofthe treating blocks Ba and Bb. When the transport directions areconsidered, the number of paths is eight.

Thus, the apparatus in the second embodiment, as in the firstembodiment, allows transport paths R for transporting wafers W to beselected and changed in various ways, to carry out a series oftreatments for the wafers W conveniently.

The main transport mechanisms T_(2M) and T_(4M) transfer wafers W to andfrom the main transport mechanisms T₁ and T₃ through the fixed receiversPASS₂ and PASS₄. This construction does not require, besides the fourmain transport mechanisms T₁-T₄, any additional mechanism for movingwafers W, such as the movable receiver MPASS described in the firstembodiment. It is therefore possible to simplify the construction of theapparatus and the transport control of wafers W.

This invention is not limited to the foregoing embodiments, but may bemodified as follows:

(1) The first embodiment described above provides the movable receiverMPASS, but the invention is not limited to this. Reference is made toFIGS. 18 and 19. FIG. 18 is a plan view of a modified substrate treatingapparatus. FIG. 19 is a view in vertical section taken on line e-e ofFIG. 18. Like reference numerals are used to identify like parts whichare the same as in the first embodiment and will not be described again.

As shown in FIGS. 18 and 19, a receiver transport mechanism T_(P) isdisposed laterally of the receivers PASS₂ and PASS₄. The receivertransport mechanism T_(P) transports wafers W between the receiversPASS₂ and PASS₄. The receiver transport mechanism T_(P) has a lift base111 and a holding arm 113. The lift base 111 is vertically movable by adrive mechanism (not shown) between the height positions of thereceivers PASS₂ and PASS₄. The holding arm 113 is horizontallyextendible and retractable relative to the lift base 111 for holdingwafers W.

The receiver transport mechanism T_(P) transports to the receiver PASS₄a wafer W placed on the receiver PASS₂ by the main transport mechanismT₁ on the story K1. Then, the main transport mechanism T₄ on the storyK4 can receive this wafer W. Conversely, the receiver transportmechanism T_(P) transports to the receiver PASS₂ a wafer W placed on thereceiver PASS₄ by the main transport mechanism T₄. Then, the maintransport mechanism T₁ on the story K1 can receive this wafer W. Thus,with the receiver transport mechanism T_(P) transporting wafers Wbetween the receiver PASS₂ and receiver PASS₄, the wafers W can betransported between the story K1 and story K4 (transport path r3 in FIG.1). When transporting wafers W between the same stories, the receivertransport mechanism T_(P) is not required to transport the wafers Wbetween the receiver PASS₂ and PASS₄.

The receivers' transport mechanism T_(P) transports to the receiverPASS₂ a wafer W placed on the receiver PASS₄ by the main transportmechanism T₃ on the story K3. Then, the main transport mechanism T₂ onthe story K2 can receive this wafer W. Conversely, the receivers'transport mechanism T_(P) transports to the receiver PASS₄ a wafer Wplaced on the receiver PASS₂ by the main transport mechanism T₂. Then,the main transport mechanism T₃ on the story K3 can receive this waferW. Thus, with the receivers' transport mechanism T_(P) transportingwafers W between the receiver PASS₂ and receiver PASS₄, the wafers W canbe transported between the story K2 and story K3 (transport path r4 inFIG. 1).

(2) The first embodiment described above provides the receivers PASS₂and PASS₄, but the invention is not limited to this. A change may bemade to transport wafers W between the same stories through the movablereceiver MPASS. Such modification can omit the receivers PASS₂ andPASS₄.

(3) In the second embodiment described above, each of the main transportmechanisms T_(2M) and T_(4M) can transport wafers W to and from both thereceivers PASS₂ and PASS₄. The invention is not limited to thisconstruction. For example, each of the main transport mechanisms T₁ andT₃ of the coating block Ba may be modified to have the same constructionas the main transport mechanism T_(2M) or T_(4M), to transport wafers Wto and from both the receivers PASS₂ and PASS₄. Further, each of themain transport mechanism T_(2M) and T_(4M) may be modified to have thesame construction as the main transport mechanism T₂ or T₄ in the firstembodiment, so that only each main transport mechanism T₁ or T₃ of thecoating block Ba may be able to transport wafers W to and from both thereceivers PASS₂ and PASS₄.

(4) In the second embodiment described above, each of the main transportmechanisms T_(2M) and T_(4M) of the developing block Bb can transportwafers W to and from both the receivers PASS₂ and PASS₄. The inventionis not limited to this construction. The construction may be modifiedsuch that, for example, while the main transport mechanism T2M cantransport wafers W to and from both the receivers PASS₂ and PASS₄, themain transport mechanism T_(4M) can transport wafers W to and from onlythe receiver PASS₄ and not the receiver PASS₂. In this case also, wafersW can be transported between the story K2 and story K3. Conversely, theconstruction may be modified such that, while the main transportmechanism T_(4M) can transport wafers W to and from both the receiversPASS₂ and PASS₄, the main transport mechanism T_(2M) cannot transportwafers W to and from the receiver PASS₄. In this case also, wafers W canbe transported between the story K4 and story K1.

(5) In the second embodiment described above, each of the main transportmechanisms T_(2M) and T_(4M) is constructed vertically movable. Theinvention is not limited to this. As long as both the receivers PASS₂and PASS₄ are accessible, each of the main transport mechanisms T_(2M)and T_(4M) may be modified to be a vertically extendible andcontractible mechanism.

(6) In each embodiment described above, each treating block Ba or Bb hastwo stories. The invention is not limited to this. For example, eachtreating block Ba or Bb may be modified to have three or more stories.

Even where three or more stories are arranged vertically, at least onetransport path r that can transport wafers W between different storiesof the coating block Ba and developing block Bb will serve the purpose.Take the construction in the first embodiment, for example. Where eachof the treating blocks Ba and Bb is divided into three or more stories,what is required is just to construct the movable receiver MPASS to bevertically movable between two or more stories. It is possible, ofcourse, to modify so that each story of the coating block Ba maytransfer wafers W to and from all the stories of the developing blockBb. Specifically, the movable receiver MPASS may be constructedvertically movable to all the stories.

Where the construction of the second embodiment has each treating blockBa or Bb divided into the three or more stories, each of the maintransport mechanisms T_(2M) and T_(4M) may be constructed verticallymovable to two or more stories in the developing block Bb. It ispossible, of course, to modify so that each of the main transportmechanisms T_(2M) and T_(4M) may be vertically movable to all thestories.

(7) In each embodiment described above, the treating section 3 includestwo treating blocks Ba and Bb in juxtaposition. The invention is notlimited to this construction. For example, the treating section 3 may bemodified to include three or more treating blocks.

Where three or more treating blocks are juxtaposed, the treating blocksadjoin in two or more locations. However, wafers W may be transportedbetween different stories in at least one of such locations. It ispossible, of course, to modify so that wafers W be transported betweendifferent stories in all the locations where the treating blocks adjoin.

(8) In each embodiment described above, the treating blocks areexemplified by the coating block Ba and developing block Bb. Theinvention is not limited to this. A different treating block may beemployed as appropriate, for performing other treatment for wafers Wsuch as cleaning Depending on the type of treatment given by thetreating section 3, it is possible to omit the exposing machine EXPprovided separately from and adjacent the subject apparatus.

(9) The constructions of each embodiment and each modification describedabove may be combined as appropriate.

This invention may be embodied in other specific forms without departingfrom the spirit or essential attributes thereof and, accordingly,reference should be made to the appended claims, rather than to theforegoing specification, as indicating the scope of the invention.

What is claimed is:
 1. A substrate treating apparatus comprising: afirst treating block; and a second treating block disposed adjacent tothe first treating block; each of the first treating block and thesecond treating block including a plurality of stories arrangedvertically; each of the plurality of stories including: treating unitsfor treating substrates; and a main transport mechanism for transportingthe substrates to and from the treating units; wherein the substratesare transportable between the plurality of stories of the first treatingblock and the plurality of stories of the second treating block at sameheights as corresponding stories of the first treating block; andwherein the substrates are transportable between the plurality ofstories of the first treating block and the plurality of stories of thesecond treating block at different heights from corresponding stories ofthe first treating block.
 2. The apparatus according to claim 1 furthercomprising: a plurality of fixed receivers provided for respectivestories, the plurality of fixed receivers being arranged between thefirst treating block and the second treating block; and a receivertransport mechanism for transporting the substrates between theplurality of fixed receivers.
 3. The apparatus according to claim 2wherein: the main transport mechanisms on the respective stories arecapable of transporting the substrates to and from the plurality offixed receivers provided for same stories as the main transportmechanisms; and the receiver transport mechanism is vertically movablebetween height positions of the plurality of fixed receivers providedfor the respective stories.
 4. The apparatus according to claim 1wherein: each of the first treating block and the second treating blockincludes: an upper story; and a lower story located below the upperstory; wherein the substrates are transportable between the upper storyof the first treating block and the upper story of the second treatingblock, and between the lower story of the first treating block and thelower story of the second treating block; and the substrates aretransportable between the upper story of the first treating block andthe lower story of the second treating block, and between the lowerstory of the first treating block and the upper story of the secondtreating block.